Qualcomm e netefalitse hore ketsahalo ea eona ea matsatsi a mabeli ea Tech Summit e tla etsahala ka December, joalo ka ha ho ne ho nahanoa bakeng sa libeke tse 'maloa tse fetileng. E tla ba hantle ka la 1 Tšitoe. Leha k'hamphani e sa e netefatsa ka molao, e kanna ea senolela sechaba chip e ncha ea Snapdragon 875 ketsahalong e hlophisitsoeng ka dijithale.
Ho latela litlaleho tse seng molaong ho fihlela joale, Snapdragon 875 e tla ba chip ea pele ea 5nm ea Qualcomm. Ho tlalehoa hore e tla ba le processor e le 'ngoe ea Cortex-X1, li-cores tse tharo tsa Cortex-78 le li-cores tse nne tsa Cortex-A55. Ho boleloa hore modem ea Snapdragon X5 60G e tla kopanngoa ho eona.
U ka thahasella
The chip, e lokelang ho etsoa ke Samsung's semiconductor Division Samsung Foundry, ho tlalehoa hore e tla ba 10% ka potlako ho feta Snapdragon 865 le hoo e ka bang 20% e sebetsang hantle haholoanyane mabapi le tšebeliso ea matla.
Ha ho hlake hajoale hore na Qualcomm e rera ho hlahisa lichifi tse ling ketsahalong eo. Ho na le taba ea hore e tla sebetsa ho chipset ea eona ea pele ea 6nm Snapdragon 775G, eo ho lebelletsoeng hore e tla ba mohlahlami oa Snapdragon 765G chip. Ho feta moo, ho boleloa hore e ntse e hlahisa chip e 'ngoe ea 5nm le chip e tlaase.
E 'ngoe ea lifono tsa pele tse tla tsamaisoa ke Snapdragon 875 e tla ba mohlala o kaholimo ho lets'oao le latelang la Samsung, ho latela litlaleho tsa morao-rao tsa anecdotal. Galaxy S21 (S30). Mefuta e meng e lokela ho sebelisa chip ho tsoa ho workshop ea Samsung kapa ho lula bakeng sa Snapdragon 865.
