Li-chipsets ka bobeli li sebelisitsoe letotong la lifono Galaxy S22, Exynos 2200 le Snapdragon 8 Gen 1, li lapetse matla 'me li chesa ho feta tekano, e leng se bakang ts'ebetso e soabisang ea lipapali le bophelo bo bobe ba betri. Hoo e ka bang li-flagship tse ling kaofela li tobane le bothata bona Android lifono ho tloha selemong sena. Leha ho le joalo, li-smartphones tse tlang tsa Samsung li ka li qoba.
Ho latela sebui se hlomphuoang sa Ice universe, ho tla ba le "benders" Galaxy Ho tloha Fold4 a Ho tloha Flip4 e tsamaisoa ke Snapdragon 8 Gen 1+ chipset (ka linako tse ling e thathamisitsoe e le Snapdragon 8 Gen 1 Plus). Qualcomm ha e so senole chip, empa ho latela litlaleho tsa anecdotal, e hahiloe holim'a ts'ebetso ea TSMC ea 4nm, e etsa hore e sebetse ka matla ha e bapisoa le Exynos 2200 le Snapdragon 8 Gen 1 (lichifi tsena li etsoa ho sebelisoa ts'ebetso ea Samsung ea 4nm).
Fotogallery
Theknoloji ea tlhahiso ea li-semiconductor chip lifekthering tsa TSMC esale e le holimo ho feta e sebelisoang ke lekala la Samsung, Samsung Foundry. Ha ho makatse hore ebe senatla sa semiconductor sa Taiwan le sona se khethile ho etsa li-chipsets tsa A le M lilemong tse 'maloa tse tlang. Apple.
U ka thahasella
Le hoja sena se hlile se soabisa Samsung Foundry, bakeng sa karohano ea Samsung MX (Mobile Experience), e etsang li-smartphone le matlapa har'a lintho tse ling. Galaxy, ho fapana le hoo, ke litaba tse molemo. Ho ka lebelloa seo Galaxy Z Fold4 le Z Flip4 li tla fana ka ts'ebetso e phahameng le bophelo ba betri ho feta letoto Galaxy S22 le moloko oa hajoale oa "puzzles" oa Samsung.
