Karolo ea Samsung ea semiconductor ea Samsung Foundry e boletse nakong ea ketsahalo ea Samsung Foundry 2022 hore e tla tsoelapele ho ntlafatsa li-chips tsa eona tsa semiconductor ho li etsa tse nyane, tse potlakileng le tse sebetsang hantle haholoanyane. Ho fihlela sena, e phatlalalitse merero ea eona ea ho hlahisa lichifi tsa 2 le 1,4nm.
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Empa pele, ha re bue ka lichifi tsa 3nm tsa k'hamphani. Likhoeli tse 'maloa tse fetileng, e qalile ho hlahisa 3nm ea pele lefatšeng li-chips (ho sebelisa mokhoa oa SF3E) ka theknoloji ea GAA (Gate-All-Around). Ho tsoa ho theknoloji ena, Samsung Foundry e tšepisa ntlafatso e kholo ts'ebetsong ea matla. Ho tloha 2024, k'hamphani e rera ho hlahisa moloko oa bobeli oa 3nm chips (SF3). Li-chips tsena li tlameha ho ba le li-transistors tse nyane tsa bohlano, tse lokelang ho ntlafatsa ts'ebetso ea matla le ho feta. Selemo hamorao, k'hamphani e rera ho hlahisa moloko oa boraro oa 3nm chips (SF3P +).
Ha e le li-chips tsa 2nm, Samsung Foundry e batla ho qala ho e hlahisa ka 2025. Joaloka lisebelisoa tsa pele tsa Samsung, ba tla ba le theknoloji ea Backside Power Delivery, e lokelang ho ntlafatsa tshebetso ea bona ka kakaretso. Intel e rera ho kenyelletsa mofuta oa eona oa theknoloji (e bitsoang PowerVia) ho li-chips tsa eona pele ho 2024.
U ka thahasella
Ha e le li-chips tsa 1,4nm, Samsung Foundry e rera ho qala ho e hlahisa ka 2027. Hona joale, ha ho tsejoe hore na ba tla tlisa ntlafatso efe. Ntle le moo, k'hamphani e phatlalalitse hore ka 2027 e ikemiselitse ho eketsa makhetlo a mararo matla a eona a tlhahiso ea chip ha a bapisoa le selemo sena.
